Preparation of high surface area Cu?Au bimetallic nanostructured materials by co?electrodeposition in a deep eutectic solvent

Our sustainable future requires finding new, affordable and green routes to prepare nanostructured materials used in renewable energy conversion. In this work we present an electrodeposition method a deep eutectic solvent (DES) bimetallic high surface area nanostructures of Cu Au with tunable structure composition. The metal performed choline chloride within urea allows us tailor the size, morphology elemental composition deposits. We combine electrochemical methods scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS) dispersive (EDS) characterize electrodeposited materials. assess increase electroactive through analysis lead underpotential deposition (UPD) on prepared films. Integrated Pb UPD charge values ca. 1600–4000 ?C/cm2 for Cu-Au films have been calculated, suggesting 5–14 fold active compared flat surfaces polycrystalline or Au. reports versatile environmentally friendly route DES. combination tailored show that DES is promising development multimetallic electrocatalysts.